Chip and integrated module supplier Sivers Semiconductors AB of Kista, Sweden says that its US subsidiary Sivers Semiconductors Inc has received an award worth $375,000 (about 4MSEK) under the US Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc of Santa Barbara, CA, USA. The program aims to develop three-dimensional heterogeneously integrated (3DHI) technologies. PseudolithIC and Sivers will specifically investigate 3DHI systems for millimeter-wave (mmWave) applications in the 5G, SATCOM and defense sectors.
“We are excited to team PseudolithIC’s innovative heterogeneous integration technology with the proven performance of Sivers’ RF SOI beamforming chipsets,” comments PseudolithIC’s CEO Dan Green. “This combination of silicon and III-V technology will enable access to the millimeter-wave spectrum with performance and scale surpassing any single, monolithic technology.”